[Tccc] Call for participation: The Seco...
Dijiang Huang
Dijiang.Huangatasu.edu
Wed Mar 6 18:12:39 EST 2013
ACM SIGCOMM WORKSOP
The Second Mobile Cloud Computing (MCC) Workshop
August 12, 2012
Hong Kong, China
Important Dates:
Paper Registration March 18, 2013
Paper Submission March25, 2013
Author Notification April 26, 2013
Camera Ready May 27, 2013
Workshop Date August 12, 2013
Call for Papers
Today the Internet Web Service is the main way we access any kind of
information from fixed or mobile terminals. Some of the information is
stored in the Internet Cloud, where computing, communication,and storage
services are main services provided for Internet users. In a non-distant
future many of our queries will be beyond current Internet scope and will
be about the people, the physical environments that surround us, and
virtual environments that we will be involved. Having witnessed the
phenomenal burst of research in cloud computing, Mobile Cloud Computing
(MCC) is to extend cloud computing functions, services and results to the
world of future mobile applications. MCC will also solicit research beyond
the scopes of traditional Internet Clouds or Mobile Computing
technologies. For examples, new mobile cloud networking infrastructure
using Information-Centric Networking (ICN) approaches; new service
platforms based on web OS, HTML5, etc.; mobile cloud infrastructure and
resource allocations (outsourcing, crowdsourcing, and migration
strategies); human-centric trust management, security and privacy
protections, etc.
The MCC workshop is intended to bring together researchers, developers,
and practitioners in current mobile computing and cloud computing from
academia, industry, and service providers, to share ideas, experiences,
and practical implementations related to new MCC technologies and
applications. Both position and working-in-progress papers are encouraged.
Workshop participants will discuss emerging and future trends in research
and application that integrate the cloud computing paradigm into mobile
devices, mobile applications, security and privacy, and mobile services,
evaluating the impact of mobile applications on cloud computing
techniques. To that end, papers are solicited from all MCC related areas
involving the interactions or integrations of mobile techniques and cloud
computing solutions, including, but not limited to the following topics.
MCC service architecture and designs
MCC data and storage architecture
MCC performance evaluation and measurement of MCC services and
applications
MCC software development platform and enabled new applications
MCC service platform and Quality of Experience (QoE) studies
MCC content/context-based sensing, routing, and networking
MCC security and privacy protection
MCC data and information management for MCC service providers and
users
MCC supported social media and networks,virtual community and
virtual humans
MCC supported multimedia services, advertisements, games, and
entertainments
MCC cloud-on-chip and chip-to-cloud designs and service models
MCC Virtualization and programmable infrastructure
MCC enabled individual, crowdsourcing-based sensing for application
scenarios, such as environment monitoring, energy preservation,
intelligent transportation, smart grid/home, healthcare and monitoring,
personal cloud, ad hoc cloud, mission-critical cloud,collaborative
surveillance, etc.Submissions
All submissions must be original work not under review at any other
workshop, conference, or journal. The workshop will accept papers
describing completed work as well as work-in-progress, so long as the
promise
of the approach is demonstrated. Radical ideas, potentially of a
controversial nature, are strongly encouraged. Submissions must be no
greater than 6 pages in length and must be a PDF file. Reviews will be
single-blind: authors name and affiliation should
be included in the submission. Submissions must follow the formatting
guidelines at
http://conferences.sigcomm.org/sigcomm/2013/.
Papers should be submitted via the submission site:
http://mcc13.mobicloud.asu.edu/. Papers must include the author name and
affiliation for single-blind peer
reviewing by the program committee. Authors of accepted papers are
expected to present their papers at the workshop.
Program Committee:
TPC Co-Chairs:
Mario Gerla, University of California Los Angeles, USA
Dijiang Huang, Arizona State University, USA
Committee Members:
Nath Badri, Rutgers, USA
Victor Bahl, Microsoft Research, USA
Fan Bai, General Motors Research & Development, USA
Paolo Bellavista, DEIS University of Bologna, Italy
Thomas Michael Bohnert, Zurich University, Switherland
Flavio Bonomi, Cisco Inc., USA
Samia Bouzefrane, CNAM, France
Jose Maria Alcaraz Calero, HP Research Lab, Bristol, UK
Andrew T. Campbell, Rutgers, USA
Wenguang Chen, Tsinghua University, China
Marco Conti, CNUCE, Italy
Christophe Diot, Technicolor, France
Falko Dressler, University of Innsbruck, Austria
Serge Fdida, Paris VI, France
Jeffrey R. Foerster, Intel, USA
Mario Di Francesco, Aalto University, Finland
Silvia Giordano, University of Lugano, Switherland
Ran He, Orange Lab, France
Myong Kang, Naval Research Lab (NRL), USA
Gunnar Karlsson, Kungliga Tekniska hgskolan,Sweden
Andreas Kassler, Karlstad University, Sweden
Jae Kim, Boeing, USA
Kyu-Han Kim, Hewlett-Packard Laboratories, USA
Yevgeni Koucheryavy, Tampere University of Technology, Finland
Robin Kravets, UIUC, USA
Marc Lacoste, Orange Lab, France
Gerard LeLanne, INRIA Paris, France
Liviu Lftode, Rutgers, USA
Victor Li, The University of Hong Kong, China
Songwu Lu, UCLA, USA
Gregorio Martines, University of Murcia, Spain
Rodolfo Milito, Cisco Inc., USA
Peng Ning, NCSU, USA
Jrg Ott, Aalto University, Finland
Giovanni Pau, UCLA, USA
Guy Pujiolle, Paris VI, France
James C. Ramming, Intel, USA
Kui Ren, SUNY Bufflo, USA
Marco Roccetti, University of Bologna, Italy
Limin Sun, Chinese Academia of Science, China
Cho-Li Wang, University of Hong Kong, China
Cliff Wang, Army Research Office (ARO), USA
Cong Wang, City University of Hong Kong, China
Bin Xiao, Hong Kong Polytechnic University, China
Lixia Zhang, UCLA, USA
Xinwen Zhang, Huawei Technologies, USA
Yuezhi Zhou, Tsinghua University, China
Haojin Zhu, Shanghai JiaoTong University, China
_______________________________________________
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