[Tccc] CFP for Special Issue on Novel On-Chip Parallel Architectures and Software Support for Journal of Parallel Computing

Mei.Yang@unlv.edu Mei.Yang
Sun Jul 1 03:59:47 EDT 2012


     Call for Papers

     Special Issue on Novel On-     Software Support

     Journal of Parallel Co
     [1]http://w     ww.journals.elsevier.com/parallel-computing/#description
     
     T
     <
     This special issue attempts to create a platform to fo     ideas and technical insights in the design and analysis of emergin     g parallel architectures and systems and their scientific,
     engineering, and     like to focus on iss     programming, system-on-chip architectu     application-specific multiprocessor architectures/systems, and     OS/software support. We invite submissions of regular papers with
     unpublis     extended version o     Computing Architectures (HPC     Conference on Information Technology
     Specific Topics:

     Topics of interest include     following:
     * Multi/many-core processor architectures
     * System-on-chip (SoC) and network-on-chip (NoC) architecture     * Application-specific multiprocesso     * Power-effici       systems
     * Application modeling and mapping schemes for multi       systems
     * Parallel pro       multi/many-core systems<     * Parallelization and scheduling methodologies fo       systems
     * OS/system/     * OS/system/software support for processor management (sch       and heterogeneity)
     * OS/system     * OS/system/software support for multithreading, synchronization,
       an     * Debugger and performan       processors

     
     J
     All submitted papers will be peer-review     must conform to the

     journal guid
     [2]http://www.elsevier.com/wps/find/journaldescription.cws_hom     e/367/description

     Guest Editors:

     Fangyang Shen, New      nbsp;[3]fangyangshen at gmail.com

     Mei Yan
     Maurizio Palesi, Kore University, Italy     zio.palesi at unikore.it

     Important Deadlines

     Submission of special is
     Notification of special issue accep
     Submission of final journal version: Oct. 1
   
References

   1. 3D"http://www.journ=/
   2. 3D"http://w=/
   3. 3D"mailto:fangyangshen at gma   4. 3D"mailto:maurizio.palesi at unikore.it"



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