[Tccc] CFP: International Workshop on Internet of Things Technology and Architectures (Co-located with IEEE MASS 2011, Valencia, Spain)

Antonio Iera antonio.iera
Fri May 6 12:39:26 EDT 2011


   Apologies if you received multiple copies of this CFP.

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International Workshop on Internet of Things
Technology and Architectures

   Workshop date: October 17, 2011
   (Co-located with IEEE MASS 2011, Valencia, Spain)
   Web site: [1]http://iotech-ws.com
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   The realization of the IoT vision entails several technical
   challenges: smart objects should communicate using energy efficient
   but standard solutions, which should then be Internet compatible,
   i.e., they should exploit IPv6 addressing so that smart objects could
   natively be connected with Internet networks. Suitable architectures
   must be identified for communication, security, billing, accounting,
   etc. Moreover, adequate solutions should be designed to make the
   communication secure (authentication, encryption, etc.).
   The networks that we foresee for IoT are no longer bound to be sensor
   islands and diverse physical layer technologies and processing
   capabilities may differ across the nodes composing a IoT. The
   application scenarios for IoT are extremely appealing and with a
   strong potential for societal impact, ranging from smart buildings to
   smart energy grids, where structures can be controlled for energy
   frugality, while guaranteeing good performance in terms of comfort,
   security, etc. Major researches as well as industrial efforts are
   currently ongoing for all these issues. However, most of them remain
   open areas of research.
   TOPICS OF INTEREST
     * Reference and Concrete Architectures for the Internet of
       Things. 
     * Service frameworks for the Internet of Things. 
     * New communication paradigms for the Internet of Things. 
     * Security approaches for the Internet of Things. 
     * Security primitives and protocols for embedded and constrained
       communication devices. 
     * Protocol stacks for the communication (e.g., IETF RPL) and the
       interoperability of IoT devices. 
     * Improvements to standard protocols for the IoT domain. 
     * Technologies for the native IPv6 interoperability of constrained
       communication devices (e.g., 6LowPAN). 
     * RESTful communication approaches for energy constrained
       communication devices. 
     * Lightweight approaches for the description of sensor data (e.g.,
       EXI). 
     * Lightweight transport protocols for constrained communication
       devices.  
     * Enabling technologies for capturing and handling real-world events
       and information. 
     * Lightweight signal processing technologies for data analysis and
       prediction. 
     * Distributed data compression, approximation and recovery of
       distributed sensor data. 
     * Privacy enhancing techniques for handling sensory and contextual
       information. 
     * Virtualization of Wireless Sensors or clusters of sensors. 
     * Hardware architectures for smart communicating objects (e.g., IEEE
       802.15.4e). 
     * Simulators for the Internet of Things. 
     * Solutions for trust and security. 

   IMPORTANT DATES
   Submission of research papers due:              June 26, 2011
   Notification of acceptance:              2011
   Camera-ready papers due:               2011
    PAPER SUBMISSION
   Papers should contain original material and not be previously
   published or currently submitted for consideration elsewhere.
   Manuscripts must be submitted by using the EDAS conference management
   system ([2]http://edas.info/ [3]). Conference language is English.
   Prospective authors are encouraged to submit a PDF version of the full
   paper, with all fonts embedded, using the ACM conference proceedings
   format. Paper length is limited to six two-column pages, in a font no
   smaller than ten points.  Accepted papers will be published in the
   IEEE MASS Proceedings and will be archived in IEEE Xplore.
   General Chairs
   Michele Rossi (DEI, University of Padova, Italy)
   Nicola Bui (Patavina Technologies, Italy)
   Alessandro Bassi (Bassi Consulting, France)
   Publicity Chair
   Antonio Iera (ARTS, Universit? Mediterranea di Reggio Calabria,
   Italy)
   Technical Program Committee
   Adam Dunkels (SICS, Sweden)
   Alberto Cerpa (UC Merced, US)
   Alex Gluhak (University of Surrey, UK)
   Andreas Terzis (Johns Hopkins University, US)
   Antonio Ruzzelli (UCD Dublin, Ireland)
   Gaia Maselli (University of Rome "La Sapienza", Italy)
   Jian Ma (Wuxi SensingNet Industrialization Research Institute, China)
   Joerg Widmer (IMDEA Networks, Spain)
   Kay R?mer (University of L?beck, Germany)
   Lirong Zheng (Fudan University, China)
   Michele Zorzi (DEI, University of Padova, Italy)
   Mischa Dohler (CTTC, Barcelona, Spain)
   Omprakash Gnawali (Stanford, US)
   Philippe Cousin (eGlobalMark, France)
   Sean Shen (CNNIC, China)
   Stefan Dulman (Delft University of Technology, The Netherlands)
   Thorsten Kramp (IBM Zurich)
   Tommaso Melodia (SUNY @ Buffalo, US)

References

   1. 3D"http://iotech-ws.com/"
   2. 3D"http://edas.info/"
   3. 3D"http://edas.info/"



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