[Tccc] 转发: CFP for Special Issue on Novel On-Chip Parallel Architectures and Software Support for Journal of Parallel Computing

Mei.Yang@unlv.edu Mei.Yang
Wed Jun 13 05:17:51 EDT 2012




     Ca
     Special Issue on&nb     Software Support

     Journal of Par
     [1]http:/     /www.journals.elsevier.com/parallel-computing/#description

     T
     This special issue attempts to create a platform to fost     ideas and technical insights in the design and analysis of emerging
          engineering, and c     like to focus on issue     programming, system-on-chip architecture     application-specific multiprocessor architectures/systems, and O     S/software support. We invite submissions of regular papers with
     unpublishe     extended version of      Computing Architectures (HPCA)     Conference on Information Technology: 
     Specific Topics:

     Topics of interest include, but      following:
     * Multi/many-core processor architectures
     * System-on-chip (SoC) and network-on-chip (NoC) architectures     * Application-specific multiprocessor architecture     * Power-efficient architecture       systems
     * Application modeling and mapping schemes for multi/many-core/SoC
       sys     * Parallel programming models and        multi/many-core systems
     * Parallelization and scheduling methodologies for multi/many-core
       syst     * OS/system/software support for mem     * OS/syst       and heterogeneity)     * OS/system/software support for power      * OS/system/software su       and parallelism<       analysis tools for multi/many
     Journal Guide for Authors:
     <     small">All sub     manuscripts mus
     journal guide for Authors on:

     [2]http://www.elsevier.com/wps     /find/journaldescription.cws_home/367/description

     G
     Fangyang Shen, New York City College of
     Technology, [3]fangyangshen at gmail.com

     Mei Yang, University of Nevada, Las Vegas, [4]mei.yang at unlv.edu

     Maurizio Palesi, Kore Un     iversity, Italy, [5]maurizio.palesi at unikore.it

     Important Deadlines

     Submission
     Notification of special
     Submission of final journal vers
   
References

   1. 3D"http://www.j=/
   2. 3D"http://www.elsevier.com/wps/find/journaldescrip   3. ="mailto:fangyangshen at gmail.com"
   4. ="mailto:mei.yang at unlv.edu"
   5. 3D"mailto:maurizio.palesi at unikore.it"



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